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Chips & Infrastructure · first seen 19 October 2026, 02:35 UTC

Hanmi targets 2027 Wide TC Bonder launch for AI packaging

South Korean equipment maker Hanmi Semiconductor showed HBM and AI chip packaging tools at SEDEX 2026, including the TC Bonder 4 for HBM4 production and the Wide TC Bonder, planned for 2027. It also introduced five 2.5D packaging products.

Hanmi Semiconductor

Read it at DigiTimes Asia →

Coverage: 2 sources, in order

  1. DigiTimes Asia Read the article →
  2. digitimes Read the article →

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