Samsung chair Lee visits Yokohama packaging lab for AI chip edge

Advanced packaging is a key AI chip bottleneck, and Samsung is investing heavily in Japan.

Samsung is investing ¥40B (about $253.5M) over five years in its Advanced Package Lab in Yokohama, Japan. Chairman Lee Jae-yong visited the packaging research hub to boost AI chip materials and equipment cooperation.

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Coverage: 10 sources, in order

1. 01 Nov 07:00 Chosunbiz Read the article →
2. 01 Nov 07:25 BigGo Finance Read the article →
3. 01 Nov 07:41 Aju Press Read the article →
4. 01 Nov 08:08 Korea JoongAng Daily Read the article →
5. 01 Nov 09:31 Breakingthenews.net Read the article →
6. 01 Nov 11:18 더글로벌기빙뉴스 Read the article →
7. 02 Nov 02:00 Businesskorea Read the article →
8. 02 Nov 02:30 BusinessKorea Read the article →
9. 02 Nov 04:09 DigiTimes Asia Read the article →
10. 02 Nov 04:09 digitimes Read the article →

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