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Datacenters & Chips ยท first seen 22 October 2026, 05:05 UTC

Tesla, Nvidia reportedly to invest $2.8B in Samsung Electro-Mechanics

Substrate supply is a bottleneck for AI chip packaging and datacenter buildouts.

Report says Tesla and Nvidia will invest 3.7 trillion won ($2.8B) in Samsung Electro-Mechanics for AI semiconductor substrates. Nokia and Besi also beat estimates on AI datacenter demand.

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  29. NVIDIA Developer Read the article โ†’
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